Детали блога

As we approach the end of 2025, the silicon carbide (SiC) market is in the midst of significant changes, with noticeable divergence in pricing trends and the material’s role across industries. While bulk SiC prices are rising due to increased costs in raw materials, 6-inch SiC wafers are experiencing aggressive price reductions triggered by excess supply. However, the material's thermal management properties are pushing it into new high-value applications, particularly in artificial intelligence (AI) and high-performance computing (HPC).

Raw Material Prices Rise Amid Growing Demand

In recent weeks, the price of bulk SiC materials, such as green and black SiC powders, has been steadily increasing. According to industry sources, the price of SiC has recently reached CNY 6,271 per metric ton, reflecting a small rise of 0.21% from the previous week. This price hike is driven by several factors, including tightening feedstock supplies, higher downstream demand, and production limitations caused by environmental regulations.

These factors are exerting upward pressure on the cost of raw SiC, which is passed along the supply chain, affecting everything from distributors to end users. In contrast, while basic SiC materials face rising prices, the pricing trend for 6-inch SiC wafers is quite the opposite.

6-Inch SiC Substrate Price War

The supply glut of 6-inch SiC substrates has created a competitive market where prices have dropped drastically. With major manufacturers ramping up production, excess supply has led to a significant decrease in substrate prices. As of late 2025, the price of 6-inch SiC wafers has fallen below USD 500 per unit, marking a 20% price reduction since mid-2024. In some cases, suppliers are offering these wafers at near-cost prices in a bid to maintain market share.

This trend is intensifying competition and could potentially reshape the global SiC substrate market, as smaller suppliers struggle to survive in a saturated market. With wafer prices continuing to drop, further market consolidation seems inevitable.

SiC’s Strategic Role in AI and HPC Applications

While the SiC market faces pressure on the pricing front, its application in AI and HPC is emerging as the driving force behind the material’s continued growth. SiC’s high thermal conductivity, which can reach up to 500 W/m·K, makes it an ideal candidate for managing the extreme heat generated by next-generation AI processors. Traditional cooling solutions are no longer sufficient, creating an urgent need for advanced materials like SiC.

Some notable developments include:

• NVIDIA Integrates SiC in Rubin Platform: NVIDIA is planning to incorporate SiC substrates into its 2025 Rubin platform, replacing traditional silicon with SiC interposers. This shift is crucial for managing the thermal loads generated by AI accelerators, enabling higher efficiency and performance in next-gen AI chips.

• TSMC’s Focus on 12-Inch SiC for HPC: TSMC is aggressively pursuing the development of 12-inch single-crystal SiC as a high-performance thermal carrier. These large-diameter wafers are set to replace conventional ceramic substrates in HPC systems, which require highly efficient heat management.

• SiC Power Devices in Data Centers: As more data centers adopt 800V HVDC power systems, SiC power devices are becoming an essential component. SiC’s ability to handle high voltages and heat is particularly valuable for powering the growing infrastructure required for AI and cloud computing applications.

• SiC in Advanced Optical Systems: With a refractive index of 2.6–2.7, SiC is well-positioned to meet the demands of next-generation augmented reality (AR) and mixed reality (MR) devices. Its optical properties make it a potential candidate for use in lightweight, high-performance optical elements in AR/MR headsets.

Looking Ahead: SiC’s Expanding Role

Despite current price fluctuations in certain segments of the SiC market, the long-term outlook for SiC is highly positive. Its exceptional properties in both thermal and optical domains are making it increasingly indispensable in cutting-edge applications like AI, HPC, and advanced optical devices. As demand for AI accelerates and data centers continue to evolve, SiC will play a pivotal role in shaping the future of high-performance technology.

In conclusion, while the SiC market navigates challenges related to raw material prices and substrate competition, its emerging applications in AI and HPC ensure a promising future. With technological advancements paving the way for more diverse uses, SiC is poised to become a cornerstone material in the next generation of high-tech solutions.