Name: Соединение пластин
Uploaded: 2026-03-10CDT09:20:19-05:00
Duration: 2 min 8 s
Description: Discover the advanced Wafer Bonder Equipment designed for high-precision bonding of silicon carbide (SiC) wafers. This equipment supports room temperature and hydrophilic bonding for 4, 6, 8, and 12-inch wafers, ideal for SiC-Si and SiC-SiC applications. Perfect for power semiconductor manufacturing and research.

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Соединение пластин

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April 11, 2025

Ключевое слово: научное оборудование лаборатории

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#ультрафиолетовый метр пропускаемости #Светлый метр пропускаемости #метр светлой передачи

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Discover the advanced Wafer Bonder Equipment designed for high-precision bonding of silicon carbide (SiC) wafers. This equipment supports room temperature and hydrophilic bonding for 4, 6, 8, and 12-inch wafers, ideal for SiC-Si and SiC-SiC applications. Perfect for power semiconductor manufacturing and research.

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